A. Assessment of interface definitions

The individual PIN definitions coming out of the display must be consistent with the PIN definitions connected to the customer’s motherboard.
The following is a 37pin interface definition
Pin No. Symbol Description Note
1 GND Ground —
2 VCI(2.8V) Power Supply Input
3 IOVCC(1.8V/2.8V) Power Supply Input
4 /CS Chip select signal pin Input
5 RS Register select signal pin Input
6 /WR Write signal pin Input
7 /RD Read signal pin Input
8 /RESET Reset signal Input
9 DB0 Data bus pin Input / Output
10 DB1 Data bus pin Input / Output
11 DB2 Data bus pin Input / Output
12 DB3 Data bus pin Input / Output
13 DB4 Data bus pin Input / Output
14 DB5 Data bus pin Input / Output
15 DB6 Data bus pin Input / Output
16 DB7 Data bus pin Input / Output
17 DB8 Data bus pin Input / Output
18 DB9 Data bus pin Input / Output
19 DB10 Data bus pin Input / Output
20 DB11 Data bus pin Input / Output
21 DB12 Data bus pin Input / Output
22 DB13 Data bus pin Input / Output
23 DB14 Data bus pin Input / Output
24 DB15 Data bus pin Input / Output
25 (LCM_ID) LCM Identify select pin Input
26 Y-YD Touch panel down pin Input
27 X-XR Touch panel right pin Input
28 Y+YU Touch panel up pin Input
29 X+XL Touch panel left pin Input
30 LED-A LED anode for all LED Input
31 LED-1 LED cathode for LED1 Input
32 LED-2 LED cathode for LED2 Input
33 LED-3 LED cathode for LED3 Input
34 LED-4 LED cathode for LED4 Input
35 GND Ground -.
36 GND Ground -.
37 IM0 Select the MPU system interface
mode Input

B. LCD Interface Method

There are two common interface methods: CPU (also called MCU 8080 system) and RGB interface.
CPU interface: is the most common mode for small and medium-size, generally 8080 system, parallel data transfer.
It can be 8-bit, 9-bit, 16-bit, 18-bit, etc., easy and convenient to control, but requires GRAM.
RGB interface: the large screen adopts more modes, the data transmission is also divided into 6, 16, 18 bit, etc., relatively speaking.
Serial transmission of data is slower, but has the advantage of fewer interface signal lines and takes up fewer resources.

C. Drive current-voltage confirmation

Determine the drive voltage according to the LCD Panel and the SPEC of the IC, e.g. VDD, VCI, according to the backlight LED
The control IC and the corresponding current and voltage values of the LEDs are determined in series or in parallel.

D. FPA, PCB wiring space assessment

Depending on the size of the product, determine whether the FPA, PCB meets the design requirements.
Adequacy of the approximate component area.
FPA minimum line width, and whether the line spacing meets the requirements.
The PCB component space is sufficient.

E. ESD assessment

In addition to adding ESD-resistant circuits to the design, the product itself needs to be protected against static electricity. In particular. Protective measures at IC locations.

In the pre-assessment design of a new project, we review the assessed project based on the inquiry provided by the client.
The aim is to ensure the rationality of the design, the versatility of the main materials, the operability of the production process, and the reliability of the quality requirements. The assessment is generally divided into two parts, structural and electronic, to give the client some reasonable suggestions for improvement.
Based on the final assessment, it is determined whether this new project can be established or not.

Structural assessment of a new project

A. Panel suitability assessment

Select all panels that meet the required size (e.g. 2.8″ WQVGA).
Select the appropriate panel based on the customer’s display requirements, type and AA size.

B. Evaluate external dimensions

According to the newly selected panel, confirm that the outline dimensions of the product meet the customer’s outline dimension requirements.
The length, width, and thickness must not exceed the customer’s drawing requirements.
Display area AA to the edge of the product must be dimensioned to meet customer drawing requirements, i.e., AA location is consistent with customer drawing requirements.

C. Identification of Key Resources

Based on the selected panel, select compatible driver ICs and ensure the availability of panels and ICs for mass production.
Design of screen backlighting BLU, touch screen TP, circuit board FPA, PCB, etc. according to product form factor. Primary Resource.
Design drawings must be changed if materials other than panels and ICs are not available.

D. Display Requirements

Determine the surface brightness, average degree, and color of the entire display module according to the customer’s requirements for display effects.
Display color: 65K, 262K, 1600W.
Viewing angle: normal viewing angle, super wide viewing angle, full viewing angle.

E. Connectivity evaluation

The signal interface method confirms compliance with the design processing requirements.
There are generally two connection methods: soldering (including hot rod) and CON connectors (ZIF, B2B).
FPAs are appropriately located to facilitate the evaluation of processing, etc.

F. Evaluate material supplier’s processing capabilities

The ability of the existing suppliers of each material to meet design drawing requirements.
For example, FPA minimum line width, line spacing, surface treatment capability, SMT accuracy.
For example, the minimum processing capability of materials such as thin-walled backlight frames, high-brightness LEDs, and the latest high-brightness enhancement films.
Certified use, light guide plate V-cut technology, Frame and BZ integrated injection molding technology, etc.
And mass production is possible.
For example, TP minimum linearity, surface strength, number of clicks, and number of scribes to meet the requirements.

G. Productivity assessment of product assembly process

Whether the production process level of the factory can meet the requirements of the drawings and meet the mass production during processing.
For example, whether the accuracy of the bonding machine can guarantee the bonding effect of the IC.
For example, the accuracy of the polarizer’s attached bias.
For example, whether the degree of control of the solder is high.

H. Comprehensive Evaluation and Recommendations

Based on our design and production experience, we can carry out a thorough evaluation of the product’s structure, giving the customer a
The company has suggested a number of improvements to optimize the design and production of its products.
For example, increasing the BZ to improve the strength of the product.
For example, to design positioning posts to position the product during assembly.
For example, designing the first pin around the FPA to protect the Dummy pin.